Microscope Solutions for Semiconductor Manufacturing

Die Bonding

Mount the IC chips onto designated locations on lead frames.

Checking for Defects Caused from Die Bonding

A part of the die bonder sometimes hits and scratches the surface of the IC chip. To fix the issue, the cause of the scratches must be identified using detailed inspections.

Our Solution

Our BX and MX series microscopes can observe defects on IC chips with high magnification.