Microscope Solutions for

Semiconductor Manufacturing

Measuring Probe Mark Dimensions

During the electrical test of IC chips, the prober’s testing pin scratches the chips' aluminum pads. If the scratch mark is large, the electrical conductivity conditions on the aluminum pads will decay and affect the wire bonding process. As a result, the dimensions of the scratch marks must be measured.

Our Solution

Our DSX1000 digital microscope can capture 3D images and provide 3D measurements, enabling you to measure the scratch mark’s depth and width.