Notes d’application

Inspection of PGA packaging

Background

Programmable gate array (PGA) packages are designed to mount Application-specific integrated circuits (ASICs) and other high-performance integrated circuit (IC) chips that are used mainly in micro-processing units and telecommunications systems. As ICs increase in density, IC pins become smaller in size and larger in number, thereby creating a growing demand for improved quality control, as well as, a need for more detailed inspection.

Olympus solution

The Olympus DSX digital microscope is designed to allow the microscope body to tilt so that users can inspect the PGA package from the top and at an angle on both sides. This allows users to inspect vertical pins from two diagonal angles. This feature enables users to easily detect and record broken pins and any other defective parts. In addition, the image-stitching feature within the software, facilitates capture of the overall image of a large package and preserve it as a quality data set.

Features of the product

Image

Inspection of PGA packaging-1
Inspection of PGA packaging-2

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Produits utilisés pour cette application

DSX1000

Obtenez de meilleures images et de meilleurs résultats. Les microscopes numériques DSX1000 vous permettent d’analyser les défaillances avec rapidité, précision et répétabilité.