Chargeur de wafers AL120
Idéal pour des inspections en dernière étape de production à moindre coût, le système d’analyse de wafers AL120-20 consiste en un microscope d’inspection de semi-conducteurs compatible à la fois avec les FOUP (boîtes unifiées à ouverture frontale) et les FOSB (caisses d’expédition à ouverture frontale). Grâce à une conception sûre et économique, le système permet à l’opérateur de travailler en toute sécurité tout en assurant un transfert efficace des wafers, y compris pour des wafers minces et déformés.
Overview
The AL120-12 wafer handler is compatible with both FOUP (Load Port) and FOSB, ideal for lower cost back-end inspection. The safe and ergonomic design maintains operator safety while effectively transferring wafers including thin and warped wafers.
Ergonomic and Easy to Operate
- With post-process inspection in mind, particular emphasis has been placed on the ease of use and ergonomics. The AL120-12 system includes top macro, back macro and microscope inspection.
- The robotic vacuum pick-up arm provides non-contact centering of wafer for accurate placement on the microscope stage. Wafers can be rotated 360 degrees during microscope inspection.
- The AL120-12 interfaces with Olympus ' MX61L microscope providing excellent resolution and precision quality optical imaging.
- Centrally located controls and on-board macro illuminator allow operators to maintain an ergonomic and relaxed position, even for long periods of inspection.
Robust, Reliable and Safe Handling
- Olympus continues with their proven expertise in wafer handling with the AL120-12 model. Its robust and reliable design maintains wafer integrity and ensures safe handling for 300mm wafers.
- Transfer of thin and warped wafers can be safely transferred using the AL120-12 handler.
Precision and Flexibility
Accommodates Multiple Wafer Sizes for Wafer Handling and Inspection
The ability to accommodate different wafer sizes is a key for expanding wafer fabrication facilities. The AL120 series consists of three models based on wafer diameter, the 200 mm model, the 150 mm and 200 mm convertible model, and the 150 mm model for wafer sizes of 150 mm or less. Each system is designed for wafer transfer and microscope inspection. Topside and backside macro inspections are also available for all wafer sizes.
Wafer size and thickness
Functional
Enhanced Macro Inspection of Semiconductor Wafers
Macro inspection with a 360-degree rotation function (simulation)
- A 360-degree self-rotating function provides a complete macro inspection of the wafer's top and back surface, enabling easy identification of defects and particles.
- The built-in joystick controls the tilt of the wafer during topside macro inspection. Operators can adjust the angle of the wafer to optimize inspection results.
Wafer Handling Made Easy
- To meet the demands of varying inspection routines, the AL120 wafer loader is recipe driven with 10 programmable system configurations, including specific cassette types, wafer specifications, and transfer speeds. Quick push button selection lets the operator load different products instantly.
- Wafer handler parameters and recipe settings are visible on the LCD display. Operators can confirm routines and results before and after the inspection.
- The AL120 wafer loader provides non-contact optical centering and notch/flat detection and alignment. These features reduce the contact between the wafer and equipment, improving wafer cleanliness.
Maximizes Wafer Safety throughout the Wafer Transfer Process
The AL120 design includes advanced functions to maximize wafer safety. The 3-sensor system continuously monitors wafer positions for safe and proper wafer retrieval, transfer, loading, and unloading. These features prevent damage from loading more than one wafer into the slot and the pickup of accidental cross-slots.
Reliable Microscope Platform for Semiconductor Wafer Observation
The AL120 wafer loader interfaces with our MX™ series of dedicated wafer inspection microscopes that provide exceptional image resolution and clarity across a range of observation methods, including brightfield, darkfield, differential interference contrast (DIC), and near-infrared (NIR). The motorized objective turret and aperture stop are interlocked, enabling optimal illumination and contrast of each objective lens. The wafer handler can also be adapted to other microscope models on a special-order basis.
Ergonomic Stage Options for Operator Comfort and Work Efficiency
- Quick release manual vacuum stage optimizes operator comfort and efficiency. X-Y control and wafer rotation are standard.
- Further automating the inspection process, the motorized stage* can be controlled via a joystick or via pre-programmed routines. One push button drives the stage to and from the load/unload position and home position.
* Motorized stage may not be available in some areas.
Specifications
| 300mm Wafer Loader AL120-12 Specifications | ||
| AL120-LMB12-LP3 | AL120-LMB12-F | |
| Wafer Size | 300 mm in dia. (SEMI M1.15, t=775 µm) Option: 200 mm in dia. | |
| Cassette | - FOUP (Front Opening Unified Pods) - SEMI: E47.1-0200 Standard Product - FIMS-FOSB, FOSB |
- FOSB (Front Opening Shipping Box) - SEMI: M31-0999 Standard Product |
| Number of Cassettes | One Cassette (for Loading and Unloading) | |
| Cassette Placement Height | 900 mm | |
| Loading Port | Included | Not Included |
| Transfer Sequence | Top Macro Inspection, Back Macro Inspection, Micro Inspection | |
| Inspection Mode | All Wafers Inspection, Sampling Inspection | |
| Wafer Alignment | Non-contact Centering | |
| Wafer Transfer System | Vacuum-contact Mechanical Arm System | |
| Applicable Microscope | Olympus Semiconductor Inspection Microscope MX61L | |
| Utility | AC100V – 120V, 220 – 240V 3.0/1.7A 50/60Hz Vacuum -67kPa – -80kPa Clean dry air 0.5MPa – 0.6MPa |
AC100V – 120V, 220 – 240V 3.0/1.7A 50/60Hz Vacuum -67kPa – -80kPa |
| Stage | XY Manual Contact Stage: XY Coarse/Fine Motion, Included with a 360° Rotating Mechanism | |
| Mass (Excluding the Microscope) | 360 kg approx. | 270 kg approx. |