Microscope Solutions for

PCB Manufacturing

Making the Inner Layer

After applying a resist to the copper foil, the surface is etched to form a circuit. This process is repeated many times to complete the inner layer board where the circuit is formed.

Measuring the Dimensions after Etching

Inspectors must determine the dimensions of the inner layer surface after etching to help ensure proper electric transmission.

Our Solution

Our DSX1000 digital microscope can acquire 3D images and provide dimension measurements, enabling you to analyze the surface dimensions of the inner layer.

DSX series digital microscope

DSX series digital microscope

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STM series measuring microscope

STM series measuring microscope

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3D dimension of PCB

3D dimensions of a PCB

Application Notes

Measuring the shape of an automotive millimeter-wave radar's circuit board

Measuring the Shape of an Automotive Millimeter-Wave Radar's Circuit Board

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Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity

Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity

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Inspecting Glass Fiber Peeling in a Printed Wiring Board's Glass Epoxy Substrate Clear Images Are Essential for Quality Control

Inspecting Glass Fiber Peeling in a Printed Wiring Board's Glass Epoxy Substrate Clear Images Are Essential for Quality Control

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