Microscope Solutions for
PCB Manufacturing
Making the Inner Layer
After applying a resist to the copper foil, the surface is etched to form a circuit. This process is repeated many times to complete the inner layer board where the circuit is formed.
Measuring the Dimensions after Etching
Inspectors must determine the dimensions of the inner layer surface after etching to help ensure proper electric transmission.
Our Solution
Our DSX1000 digital microscope can acquire 3D images and provide dimension measurements, enabling you to analyze the surface dimensions of the inner layer.
3D dimensions of a PCB
Application Notes
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity