LEXT OLS5500 3D Optical Profilometer

The award-winning LEXT™ OLS5500 hybrid 3D optical profilometer unites laser scanning microscopy (LSM), white light interferometry (WLI), and focus variation microscopy (FVM) in one powerful platform. Designed for R&D, QA, and QC teams, it delivers precise surface detail, traceable accuracy, and an intuitive user experience to streamline workflows.

Offering 3-in-1 exceptional precision imaging with LSM, WLI, and FVM in an easy-to-use system, the OLS5500 delivers up to 40x faster throughput than conventional LSM using WLI. It is also the world’s first 3D optical profilometer that ensures guaranteed accuracy and repeatability* for both LSM and WLI measurements.

  • Product Status: This product is a replacement for the LEXT OLS5100 and earlier OLS series systems.

LEXT OLS5500 3D Optical Profilometer

Infinite Surfaces, Trusted Results

Combining laser scanning microscopy (LSM), white light interferometry (WLI), and focus variation microscopy (FVM) in one platform, the award-winning LEXT™ OLS5500 3D optical profilometer ensures every surface can be measured clearly and accurately.

The Complete Imaging Solution for Accurate Surface Measurement

  • LSM: exceptional lateral resolution for rough textures, microstructures, and steep slopes.
  • WLI: nanometer-level vertical precision for smooth or sloped surfaces and thin films.
  • FVM: macro-to-micro coverage for large or uneven areas requiring broader context.

Each method complements the others—delivering the right imaging mode for every surface. Generate comprehensive, true-to-form surface data from nanometers to millimeters and flat to steep slopes, all in a single system.

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RF package imaged using three surface metrology techniques.

RF package imaged using three surface metrology techniques.

Exceptional Precision Imaging

The OLS5500 enables you to identify subtle features and surface variations with unparalleled clarity—use LSM, WLI, and FVM to detect defects, confirm designs, and make confident decisions.

Left: With conventional lenses, distortion increases at the periphery and affects measurement accuracy. Right: With LEXT lenses, the periphery is reproduced free of distortion for accurate measurements.

Precision Across Every Surface

Whether you’re working with highly sloped samples, reflective surfaces, or complex geometries, in-house engineered objective lenses maintain clarity and shape fidelity across the full field of view.

Laser Microscopy Objectives

Dedicated LEXT objectives accurately measure peripheral areas, overcoming the measurement challenges of conventional lenses.

LEXT objective lenses from left to right: long working distance (20X, 50X, 100X), high performance (20X, 50X, 100X), and low magnification (10X).

LEXT objective lenses from left to right: long working distance (20X, 50X, 100X), high performance (20X, 50X, 100X), and low magnification (10X).

White Light Interferometric Objectives

High NA WLI objectives (up to 0.8 NA) produce sharp interference fringes and exceptional phase stability, even on steep or textured surfaces.

Comparison images of a Fresnel lens sample taken with a conventional WLI 20X objective (left, NA 0.4) and Evident’s 20X WLI objective (right, NA 0.6).

Comparison images of a Fresnel lens sample taken with a conventional WLI 50X objective (left, NA 0.55) and Evident’s 50X WLI objective (right, NA 0.8).

Comparison images of a calibration sample taken with a conventional WLI 50X objective (left, NA 0.55) and Evident‘s 50X WLI objective (right, NA 0.8).

Clarity That Uncovers the Unseen

Improve validation speed by revealing critical features that are invisible to conventional systems. From fine structures and subtle topography to transparent surfaces and low-contrast features, the OLS5500 provides multiple contrast-enhancing options to expose hidden or subtle details.

Comparison images of a polymer film. Left: laser image without DIC. Right: laser image with DIC.

Comparison images of a polymer film. Left: laser image without DIC. Right: laser image with DIC.

Comparison images of a hard disk landing zone. Left: color image without DIC. Right: color image with DIC.

Comparison stitched images of a wafer. Left: without Intelligent Shading Correction. Right: with Intelligent Shading Correction.

Seamless Large-Area Imaging

Inspect larger regions—without losing detail or image integrity. Intelligent Shading Correction minimizes artifacts and balances illumination across stitched images, ensuring seamless results even on low-contrast or uneven surfaces. This edge-to-edge clarity supports consistent analyses.

Trusted Measurements

Accurate, Trusted Measurements

Fewer retests, reworks, and rejections—thanks to trusted measurements in LSM, WLI, and FVM that you can verify and prove.

Guaranteed Accuracy and Repeatability

Obtain consistent, high-precision measurements across applications—the OLS5500 is the world’s first 3D optical profilometer that ensures guaranteed accuracy and repeatability* for both LSM and WLI measurements.

On-site calibration by Evident technicians ensures precise, repeatable measurements with time-stamped records that support alignment with international metrology standards.

Every value you measure is validated through our traceable calibration process, giving you results you can defend across audits, reports, and production reviews.

*Based on Evident’s internal research as of October 2025. The guaranteed accuracy and repeatability apply only if the device has been calibrated according to the manufacturer‘s specifications and is in defect free condition. Calibration must be performed by an Evident technician or an Evident-authorized specialist.

Illustration showing the difference between accuracy and repeatability.

Illustration showing the difference between accuracy and repeatability.

Traceability system chart for the AIST standard.

Example for the AIST standard

Length measurement module on the LEXT OLS5500 3D optical profilometer.

Length measurement module

Guaranteed Measurement Noise

Trust your height measurements—even at the nanometer scale. The OLS5500 guarantees measurement noise levels* in accordance with ISO 25178-700:2022:

  • 1 nm with MPLAPON 100X LEXT objectives
  • 0.08 nm with WLI objectives

This ensures high-resolution detection of even the most subtle topographic changes, from thin films to micro-patterned surfaces.

*You will receive a Measurement Noise Guarantee Certificate. This is a representative value measured under conditions specified by Evident and may differ from the guaranteed value.

Guaranteed Accuracy for Stitched Images

The OLS5500 incorporates a length-measuring module in its motorized stage, guaranteeing* the accuracy of stitched image data. While conventional systems rely only on pattern matching, the OLS5500 combines that with positional feedback, providing highly reliable stitched data for both LSM and WLI.

*The guaranteed accuracy for stitched images applies only to the 100 mm motorized stage. (OLS5500-SAF is available for both LSM and WLI, and OLS5500-EAF is available only for LSM).

Service and Support That Empowers

When it comes to protecting your investment and the integrity of your research, your needs come first. We stand behind our products with a commitment to prompt service and technical support to help you achieve your goals.

Maintain compliance and system uptime with our on-site calibration, global service network, and remote support—backed by 100+ years of expertise in microscopy.

Evident’s service and support team for microscopy and imaging solutions.

Smarter Workflow

Smarter Workflow, Maximized Throughput

The OLS5500’s smart automation and workflow tools are designed to make surface analysis easier and faster for users of all levels. Obtain consistent, first-time-right results in LSM, WLI, and FVM to maximize inspection efficiency and throughput.

Seamless Observations

The OLS5500 automatically generates a macro map as the stage moves, keeping every area tracked and documented for effortless navigation. With continuous autofocus, focus remains sharp throughout movement—no manual refocusing, no interruptions.

The macro map on the LEXT OLS5500 3D optical profilometer.

Smart Automation for Effortless Precision

The OLS5500 automates key measurement processes so your focus stays on analysis, not adjustment.

Acquire data quickly and easily with Smart Scan II for LSM. Place the sample on the stage, press the start button, and the system does the rest.

PEAK algorithm provides highly accurate data from low to high magnifications and reduces the data acquisition time. When measuring the shape of steps on a sample, the data acquisition time can be reduced by skipping the unnecessary scanning range in the Z-direction.

VLSI standard 80 nm height sample, captured with a LEXT 10X objective lens.

VLSI standard 83 nm height sample (MPLFLN10LEXT).

Resist pattern on a silicon surface. Image courtesy of the Nanotechnology Hub at Kyoto University.

Resist pattern on a silicon surface. Courtesy of the Nanotechnology Hub at Kyoto University.

With Tilt Adjustment Assistance, tilt correction becomes simple. With one click, the software indicates the exact amount of adjustment needed to level the sample surface. Simply follow this guidance to operate the stage.
Tilt Adjustment Assistance on the LEXT OLS5500 3D optical profilometer.

Smart Judge on the LEXT OLS5500 3D optical profilometer.

Left: Smart Judge off: Right: Smart Judge on.

Smart Judge automatically detects only reliable data, delivering accurate measurements without losing fine height irregularity data.
The OLS5500’s intuitive software interface supports fast, reliable, and repeatable measurements at scale for users of all levels. Guided workflows simplify setup and ensure consistent operation across teams.
Intuitive software interface of the LEXT OLS5500 3D optical profilometer.
Macros on the LEXT OLS5500 3D optical profilometer.

Consistency You Can Count On

Automate inspections with macros—create, edit, and run procedures for reliable results. Pair with the Smart Experiment Manager to make pass/fail decisions in a single click. Save reports as templates to streamline repeated measurements and ensure consistent results across analyses and users.

PRECiV™ software integration for routine metallography, AI-enhanced workflows, and advanced 2D analysis supports specialized applications and high-throughput production environments.

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PRECiV™ software for routine surface analysis workflows.

40x Faster Measurement Without Compromise

The OLS5500 delivers both speed and precision. Its advanced white light interferometry (WLI) mode accelerates surface measurements by up to 40 times compared to conventional LSM—without losing accuracy or traceability.

Surface measured with the LEXT 3D optical profilometer.

Sample: 60 nm step height, measurement area: 1,280 µm.

LSM: Data acquisition time: 630 s; 6×6 stitched image acquired with an LSM 50X objective (NA 0.95).

WLI: Data acquisition time: 15 s; single image acquired with a WLI 10X objective (NA 0.3).

Wider View, Faster Workflow

Save time imaging large or complex samples. The OLS5500’s high NA Mirau WLI objectives expand the measurable field of view while preserving vertical precision.

  • 20X objective: up to 6X wider coverage than conventional 50X WLI lenses.
  • 50X objective: up to 4X wider coverage than conventional 100X WLI lenses.

Fewer images per area mean fewer image stitching steps, improving efficiency while maintaining traceable, high-fidelity data.

Specifications

LEXT OLS5500 Main Unit Specifications

Model OLS5500-SAF OLS5500-EAF OLS5500-LAF
Total magnification 54X–17,280X
Field of view 16 µm–5,120 µm
Measurement principle Optical system

Reflection-type confocal laser scanning microscopy

Reflection-type confocal laser scanning DIC microscopy

Focus variation microscopy, color, color-DIC

White light interferometry -
Light receiving element Laser: photomultiplier (2ch), Color: CMOS color camera
LSM Height Repeatability σn-1 *1 *2 *5 5X: 0.45 μm, 10X: 0.1 μm, 20X: 0.03 μm, 50X: 0.012 μm, 100X: 0.012 μm
Accuracy*1 *3 *5 0.15 + L/100 μm (L: measuring length [μm])
Measurement noise*1 *4 *5 1 nm (typical)
Length Repeatability 3σn-1 *1 *2 *5 5X: 0.4 μm, 10X: 0.2 μm, 20X: 0.05 μm, 50X: 0.04 μm, 100X: 0.02 μm
Accuracy *1 *3 *5 Measurement value ±1.5%
Maximum number of measuring points in a single measurement 4096 × 4096 pixel
Maximum number of measuring points 400 megapixels
XY stage configuration Operating range 100 mm × 100 mm (3.9 × 3.9 in.) motorized 300 mm × 300 mm (11.8 × 11.8 in.) motorized
Maximum sample height 100 mm (3.9 in.) 210 mm (8.3 in.) 37 mm (1.5 in.)
Laser light source Wavelength 405 nm
Maximum output 0.95 mW
Laser class Class 2 (JIS C 6802:2018, IEC60825-1:2014, EN60825-1:2014/A11:2021,GB/T 7247.1-2024)
Color light source White LED
Electrical power 240 W 278 W
Mass Microscope body Approx. 31 kg (68.3 lb) Approx. 43 kg (94.8 lb) Approx. 50 kg (110.2 lb)
Control box Approx. 12 kg (26.5 lb)

LEXT OLS5500 WLI Specifications

WLI
Height
Repeatability σn-1 *1 *5
0.3%
Accuracy *6
1% (typical)
Surface topography repeatability *5 *7
0.08 nm
Repeatability of RMS *8
<0.008 nm

Maximum sample height

Colspan=2

68 mm

*1 Guaranteed when used in a constant temperature and constant-humidity environment (temperature: 20 ℃ ±1 ℃, humidity: 50% ± 10%) specified in ISO554(1976), JIS Z-8703(1983).
*2 For 10X or higher, when measured with dedicated LEXT objectives.
*3 When measured with a dedicated LEXT objective.
*4 Typical value when measured with a MPLAPON100X LEXT objective, and it may differ from the guaranteed value.
*5 Guaranteed under the Evident Certificate System.
*6 This is a representative value measured using step height standards of 83 nm traceable to national standards under conditions specified by Evident, and it differs from the guaranteed value. The guaranteed value is 0.15+ L/100 μm.
*7 Equivalent to the measurement noise. *8 Verified under conditions specified by Evident.

LEXT OLS5500 Application software

Standard software: data acquisition app/analysis app (simple analysis)
OLS55-BSW
Motorized stage package application*1
OLS50-S-MSP
White light interferometry application
OLS-S-WLI
Focus variation application
OLS-S-FV
Advanced analysis application*2
OLS50-S-AA
Film thickness measurement application
OLS50-S-FT
Auto edge measurement application
OLS50-S-ED
Particle analysis application
OLS50-S-PA
Experimental total assist application
OLS51-S-ETA
Sphere/cylinder surface angle analysis application
OLS50-S-SA

*1 Including auto-stitching data acquisition and multi-area data acquisition functions.

*2 Including profile analysis, difference analysis, step-height analysis, surface analysis, area/volume analysis, line roughness analysis, area roughness analysis, and histogram analysis.

LEXT OLS5500 Objective Lenses

Series
Model
Numerical Aperture (NA)
Working Distance (WD) (mm)
UIS2 objective lens
MPLFLN2.5X
0.08
10.7
MPLFLN5X
0.15
20
LMPLFLN10X
0.25
21
LEXT dedicated objective lens (10X)
MPLFLN10XLEXT
0.3
10.4
LEXT dedicated objective lens (high performance type)
MPLAPON20XLEXT
0.6
1.0
MPLAPON50XLEXT
0.95
0.35
MPLAPON100XLEXT
0.95
0.35
LEXT dedicated objective lens (long working distance type)
LMPLFLN20XLEXT
0.45
6.5
LMPLFLN50XLEXT
0.6
5.2
LMPLFLN100XLEXT
0.8
3.4
Super long working distance lens
SLMPLN20X
0.25
25
SLMPLN50X
0.35
18
SLMPLN100X
0.6
7.6
Long working distance for LCD lens
LCPLFLN20XLCD
0.45
8.3-7.4
LCPLFLN50XLCD
0.7
3.0-2.2
LCPLFLN100XLCD
0.85
1.2-0.9
White light interferometric objective lens
WLI10XMRTC
0.3
8.2
WLI20XMRTC
0.6
1.0
WLI50XMRTC
0.8
1.0

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