Microscope Solutions for
PCB Manufacturing
Processing the Outer Layer
Circuits are formed on both sides of the multilayer substrate using the same process as the inner layer.
Managing the Plating Thickness
Inspectors must check the thickness of the plated copper on a PCB to make sure that the copper is evenly plated on the board.
Our Solution
Our DSX series digital microscope or BX series metallurgical microscope combined with OLYMPUS Stream™ software enables you to measure the distribution of copper plating thickness in through holes or micro-via with a simple inspection workflow.
Cross-section of a through hole
Application Notes
Explore related applications:
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Inspecting Glass Fiber Peeling in a Printed Wiring Board's Glass Epoxy Substrate Clear Images Are Essential for Quality Control
Measuring the Via Hole Dimensions
The via-hole is used for electric conduction between layers of the substrate pattern. The width and depth of the via-hole must be measured.
Our Solution
Our STM series measuring microscope can measure the dimension of the via hole.
Position to be measured by the STM series microscope
Application Notes
Explore related applications:
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Checking the Copper Pattern for Defects
Inspectors must check for the presence of defects in copper patterns to help ensure safe, normal power distribution.
Our Solution
Our DSX series digital microscopes and BX series metallurgical microscopes provide high-magnification observation of defects on copper patterns.
High-magnification image of the copper pattern
Application Notes
Explore related applications:
Using the Olympus OLS5000 Laser Confocal Microscope to Measure the Surface Roughness of Printed Circuit Boards
Measuring the Copper Pattern
The dimensions of the copper wire can impact electric conduction, so inspectors must measure it to help ensure safe, normal power distribution.
Our Solution
Our DSX1000 digital microscope can provide cross-sectional images of copper patterns in 3D, enabling height and width measurements.
A 3D image of copper pattern
Application Notes
Explore related applications:
Using the Olympus OLS5000 Laser Confocal Microscope to Measure the Surface Roughness of Printed Circuit Boards