Microscope Solutions for Semiconductor Manufacturing

Dicing

A high-speed rotating blade cuts the wafer into individual chips.

Checking the Chipping Size after Wafer Dicing

After wafer dicing with a cutting blade, operators inspect the diced channels to check for excessive chipping and other damages. However, visual inspections with the human eye are difficult, and the scanning electron microscopy (SEM) method is time-consuming.

Our Solution

Our DSX series digital microscope and OLS series laser confocal microscope can measure the chipping size. The OLS series is recommend for inspectors who require detailed and precise measurements of chipped areas, chipping sizes, and the dicing condition.