Electronics
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Olympus Solutions for Electronics
Electronics are getting smaller, and so are their components. Inspecting microcircuits, semiconductor wafers, and other electronics is challenging because even a small piece of debris can cause a malfunction.
Manufacturers use microscopes with high-quality optics to inspect soldered connections in circuits, the condition of wires in printed circuit boards, and to look for contaminants. In some applications, the roughness of the components used in a device is measured using noncontact laser confocal microscopes to ensure they meet strict standards.
More Resources
Blog (19)
Advantages of Laser Microscopes for Measuring the Roughness of Copper Foil used in 5G PCBs
Application Notes (48)
Using a High-Resolution Digital Microscope to Perform Highly Accurate Thickness Measurements of the Internal Layer of a Multilayer Ceramic Condenser
Inspecting Glass Fiber Peeling in a Printed Wiring Board’s Glass Epoxy Substrate—Clear Images Are Essential for Quality Control
Acquiring Clear Images and Accurate Dimension Measurements of a Laminated Ceramic Capacitor Using a Digital Microscope
Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope
How a Digital Microscope’s Deep Focal Depth Enables the Complete Inspection of Connector Pins
Inspecting the Cavity Profile of Xenon Difluoride (XeF2) Etched Silicon (Si) Wafers for Suspended Antenna-Coupled Nanothermocouples
Measuring the Layer Profiles of Thin-Film Solid-State Lithium-Ion Batteries Manufactured Using the Inkjet Technique
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Evaluating the Coating on a Smartphone Housing / Film thickness measurement and 3D surface profile measurement using a laser microscope
Roughness Evaluation of the Inner Lead of a Lead Frame / Surface roughness measurement of a micro area using a laser microscope
Surface Profile Evaluation of Diffuser Plates for LCDs / Non-contact 3D shape measurement using a laser microscope
Surface profile of the light guide plate for LCDs / Non-contact 3D shape measurement using a laser microscope
Surface Roughness Measurement of Flexible Print Substrate using the Olympus OLS4100 Laser Confocal Microscope
Evaluating the Contacting Terminals of Wafer Level Chip Size Packages (CSPs) using the Olympus OLS4100 Laser Confocal Microscope
Using the Olympus OLS5000 Laser Confocal Microscope to Measure the Surface Roughness of Printed Circuit Boards
Sectioning Analysis for Ball Grid Array (BGA) Surface Mounting of Semiconductor Package using the Olympus OLS5000 Laser Confocal Microscope
