5G Device Measurement and Inspection Solutions

Precise, Non-Contact Surface Roughness Measurement

Copper Foil for Printed Circuit Boards

Printed circuit boards used in 5G applications are designed to prevent transmission loss. To do this, the copper circuit’s surface roughness is minimized.established parameters indicating various roughness criteria. The progress of processing technology and the introduction of advanced measurement instruments enable the evaluation of diverse aspects of surface roughness.

Copper Foil for Printed Circuit Boards, Image of a printed circuit board cross section

* Image of a printed circuit board cross section

Conventionally, the wettability on the copper foil side was used to control the bond quality of the base copper foil and the organic material. However, demand for surface roughness evaluation of the copper foil continues to increase as the functionality of flexible printed circuit (FPC) boards improves.

Surface Acoustic Wave Device Wafers

Surface acoustic wave devices use vibrations transmitted through a solid surface to extract certain signals from background radio waves. In high-frequency 5G applications, the back of the wafer is roughened to scatter undesirable frequencies.

Roughness Measurement Challenges

Conventional roughness measurement using a contact stylus can damage the sample’s surface and is not sensitive enough to detect minute roughness changes.

Surface Roughness Measurement

Laser Microscope Roughness Measurement

The OLS5100 3D measuring laser microscope enables highly accurate, non-contact surface roughness measurement of copper foil and wafers. It’s capable of high-resolution surface roughness measurements in very small areas without damaging the sample’s surface.