电子工业
行业
奥林巴斯电子产品解决方案
随着电子产品变得越来越小，相应的电子元件也在变小。微电路、半导体晶片和其他电子产品的检查工作充满了挑战，因为即使是一小块碎片也会导致产品出现故障。
生产商使用具有高质量光学元件的显微镜来检查电路中的焊接情况、印刷电路板中的线路形状，以及寻找污染物。在某些应用中，电子元件的粗糙度是使用非接触式激光共聚焦显微镜来进行测量的，以确保符合严格的标准要求。
更多资源
博客
应用注释
Using a High-Resolution Digital Microscope to Perform Highly Accurate Thickness Measurements of the Internal Layer of a Multilayer Ceramic Condenser
Inspecting the Cavity Profile of Xenon Difluoride (XeF2) Etched Silicon (Si) Wafers for Suspended Antenna-Coupled Nanothermocouples
Measuring the Layer Profiles of Thin-Film Solid-State Lithium-Ion Batteries Manufactured Using the Inkjet Technique
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Evaluating the Coating on a Smartphone Housing / Film thickness measurement and 3D surface profile measurement using a laser microscope
Roughness Evaluation of the Inner Lead of a Lead Frame / Surface roughness measurement of a micro area using a laser microscope
Evaluating the Contacting Terminals of Wafer Level Chip Size Packages (CSPs) using the Olympus OLS4100 Laser Confocal Microscope
Sectioning Analysis for Ball Grid Array (BGA) Surface Mounting of Semiconductor Package using the Olympus OLS5000 Laser Confocal Microscope
Maximizing Data Recovery: Utilizing 3D Digital Laser Microscopy to Image Damaged Optical Media
视频
Demonstration Digest
DSX1000: Demonstration Guaranteed The Accuracy and Repeatability
DSX1000: Demonstration Stiching Function
DSX1000: Demonstration Reproduction Function of Observation Conditions
DSX1000: Demonstration Various Observation Method With One Touch
DSX1000: Demonstration Best Image Function
DSX1000: Demonstration Free Angle Observation System
DSX1000: Demonstration Wide Field Range Observation from Macro to Micro
